The InduBond ® RFX
is a machine for registration and bonding multilayer printed circuits. Layer centering and registration are done using a custom high-precision (<10 microns) template.
Layer registration is ensured by induction soldering the layers.
The InduBond RFX also incorporates an automated system of moving heads that makes it possible to quickly solder anywhere on the panel surface. This process has been developed specifically for rigid flexible circuits.