InduBond ® 130N is a registration and induction bonding machine for aligning and soldering a group of inner layers and prepreg that make up a multilayer circuit in the step prior to pressing.
Our system provides repeatability, safety and trustworthiness.
News & events
Below we show the latest news, recommendations and promotions related to Indubond, access each one of them to read more.
Winner Innovation Award: InduBond X-Press (category: PCB fabrication), a concept in multilayer press technology utilizing electromagnetic energy to heat stainless steel separator plates
From January 25 to 27, 2022 we will be present at IPC Apex 2022 in San Diego, the reference fair for PCB manufacturers in USA. Visit us at All4PCB booth #225
From 16 to 19 November 2021 we will present at Productronica in Munich, the reference fair for PCB manufacturers in Europe.