FUSION BONDING LAMINATION
We are glad to announce that we helped another customer in the US to perform the FUSION BONDING LAMINATION process successfully with our knowledge and high temperature InduBond X-Press Technology.
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News & events
Below we show the latest news, recommendations and promotions related to Indubond, access each one of them to read more.
Read moreWinner Innovation Award: InduBond X-Press (category: PCB fabrication), a concept in multilayer press technology utilizing electromagnetic energy to heat stainless steel separator plates
Read moreFrom April 6 to 11, 2024 we will be present at IPC Apex 2024 in Anaheim, California, the reference fair for PCB manufacturers in USA.
Read moreFrom 14 to 17 November 2023 we will present at Productronica in Munich, the reference fair for PCB manufacturers in Europe.